Thermal Conductive Silicone Paste for CPU GPU LED Heat Sink 5g

$9.82 $11.44

Thermal Conductive Silicone Paste for CPU, GPU & LED Heat Sinks

Keep your electronics running cool and efficient with this high-performance thermal conductive silicone paste. Designed for CPUs, GPUs, LED modules, transistors, and other heat-generating components, this one-component room-temperature vulcanizing silicone compound delivers excellent thermal transfer, strong adhesion, and long-lasting performance — all in a convenient 5g vacuum-sealed package.

Key Features

Excellent Thermal Conductivity: 0.671 W/m-K conductivity efficiently transfers heat away from sensitive electronic components.
Low Thermal Impedance: 0.06 impedance rating ensures minimal resistance between component and heat sink surfaces.
Fast Surface Setting: Sets in as little as 3 minutes at 25°C for a quick and efficient application.
Wide Temperature Range: Operates reliably from -60°C to 200°C, with short-term tolerance up to 300°C.
Strong Bonding Strength: 25 kg bonding strength keeps heat sinks and components firmly in place.
Electrically Insulating: Insulation factor of 5.1 ensures safe use around sensitive electronic circuits.
Non-Oxidizing Vacuum Packaging: Independent vacuum packaging prevents drying and oxidation, extending shelf life.
Solvent-Free Formula: Safe for electronics, appliances, instrumentation, LEDs, and more.

Technical Specifications

Net Weight: 5g per piece
Thermal Conductivity: 0.671 W/m-K
Thermal Impedance: 0.06
Setting Time: 3 minutes (at 25°C)
Bonding Strength: 25 Kg
Insulation Factor: 5.1
Dissipation Coefficient: 0.005
Operating Temperature: -60°C to 200°C (short-term peak 300°C)
Melting Capacity: 0 (200°C / 24 Hours)
Evaporation: 0.001% (200°C / 24 Hours)
Recommended Coating Thickness: 0.1–0.5mm (thinner is better)

Common Applications

CPU and GPU processor-to-heat sink thermal interface
LED modules and LED heat sink bonding
High-power transistors and aluminum heat dissipation gaps
Silicon-controlled element diode-to-aluminum contact filling
Electronics, electrical appliances, and instrumentation thermal management
General electronic component heat transfer medium

How to Apply

Clean the component and heat sink surfaces thoroughly with isopropyl alcohol. Do not use detergent. Allow to dry completely.
Squeeze a small amount of paste directly onto the surface.
Spread evenly to a thin layer (0.1–0.5mm recommended).
Mount the heat sink immediately after application.
Recap the tube promptly after use to preserve remaining paste.

Made in Mainland China.

Package Includes

1× Thermal Conductive Silicone Paste (5g, vacuum sealed)

Frequently Asked Questions

Q: Is this thermal silicone paste electrically conductive?

A: No. This thermal conductive silicone paste is electrically insulating with an insulation factor of 5.1. It transfers heat efficiently between components and heat sinks without creating any electrical short-circuit risk, making it safe for use directly on or around circuit boards and sensitive electronics.

Q: How much paste should I apply to my CPU or GPU?

A: The recommended coating thickness is 0.1–0.5mm — the thinner the layer, the better the thermal transfer. For most CPUs and GPUs, a small pea-sized amount spread evenly across the processor die is sufficient. Avoid over-application, as excess paste can spill onto the motherboard.

Q: How long does the paste take to cure, and can I use the PC immediately?

A: The surface sets in approximately 3 minutes at 25°C. Full adhesive strength is achieved as the paste cures with heat over the first few hours of normal PC operation. You can generally power on and use your system right away after assembly.

Q: How should I store unused thermal paste to keep it from drying out?

A: The paste comes in a vacuum-sealed package specifically designed to prevent oxidation and drying. After opening, always replace the cap tightly immediately after use. Store in a cool, dry place away from direct sunlight to maximize shelf life.